*The electronic packaging handbook
edited by Glenn R. Blackwell
03-2218793

TABLE DES MATIÈRES

  1.    Fundamentals of the Design Process
  2.    Surface Mount Technology
  3.    Integrated Circuit Packages
  4.    Direct Chip Attach
  5.    Circuit Boards
  6.    EMC and PCB Design
  7.    Hybrid Assemblies
  8.    Interconnects
  9.    Design for Test
10.    Adhesive and Its Application
11.    Thermal Management
12.    Testing
13.    Inspection
14.    Package/Enclosure
15.    Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach
16.    Product Safety and Third-Party Certification

Appendix A: Definitions
Index

20 juin 2001